Products (10)
Product
in Electronic Component Manufacturing
Industrial machine for precisely placing and bonding semiconductor dies onto substrates
Product
in Computer, Electronic and Optical Product Manufacturing
A precision component in automated die attach machines that physically applies force and/or energy to create permanent bonds between semiconductor dies and substrates.
Product
in Computer, Electronic and Optical Product Manufacturing
A specialized station within a die attach machine that applies controlled heat to cure adhesives or epoxies used in semiconductor die bonding.
Product
in Computer, Electronic and Optical Product Manufacturing
A precision assembly machine used to attach semiconductor dies to substrates or leadframes using adhesive materials.
Product
in Computer, Electronic and Optical Product Manufacturing
Precision dispensing component for applying adhesives or epoxies in semiconductor die attachment
Product
in Computer, Electronic and Optical Product Manufacturing
A temperature-controlled platform that holds and heats semiconductor wafers or dies during wire bonding processes.
Product
in Computer, Electronic and Optical Product Manufacturing
A precision component in automated die attach machines that picks up semiconductor dies from wafer tape and places them onto substrates.
Product
in Manufacture of Lighting Equipment
Mechanical substrate for mounting and thermally managing individual LED semiconductor dies
Product
in Computer, Electronic and Optical Product Manufacturing
An interface component in wafer testing that establishes electrical connections between test equipment and semiconductor wafer dies.
Product
in Computer, Electronic and Optical Product Manufacturing
High-density laminate carrier that routes signals between a semiconductor die and the system PCB, forming the package's electrical and mechanical base.