Protective housing for high-resolution camera arrays in industrial imaging systems.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Weight | 0.8-3.2 kg | |
| Mounting | Standard VESA or custom flange patterns | |
| IP Rating | IP65/IP67 | |
| Dimensions | Varies by array configuration (typically 200x150x80mm to 500x400x120mm) | |
| EMI Shielding | ≥40 dB attenuation (30 MHz to 1 GHz) | |
| Thermal Conductivity | ≥150 W/m·K (aluminum housing) | |
| Operating Temperature | -20°C to +60°C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A multi-camera imaging system designed for capturing detailed visual data of printed circuit boards during optical inspection.
An optical imaging system that captures visual data for inspection, measurement, or guidance within a multi-sensor probe head.
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To protect sensitive optical and electronic components from environmental hazards while maintaining precise thermal and mechanical conditions for optimal imaging performance.
Through conductive heat transfer using aluminum alloys, thermal interface materials, and sometimes integrated heat sinks or fans to dissipate heat from internal components.
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