Structured Manufacturing Data (2026)

Bluetooth IC/Chipset

Based on aggregated insights from structured factory profiles within the CNFX directory, the standard Bluetooth IC/Chipset used in the Computer, Electronic and Optical Product Manufacturing sector typically supports operational capacities ranging from standard industrial configurations to heavy-duty production requirements.

Technical Definition & Core Assembly

A canonical Bluetooth IC/Chipset is characterized by the integration of RF Transceiver and Baseband Processor. In industrial production environments, manufacturers listed on CNFX commonly emphasize Silicon semiconductor construction to support stable, high-cycle operation across diverse manufacturing scenarios.

Integrated circuit that implements Bluetooth wireless communication protocols and functions

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Product Specifications

Technical details and manufacturing context for Bluetooth IC/Chipset

Definition

A specialized semiconductor component within a Bluetooth Module that contains the radio frequency (RF) transceiver, baseband processor, and protocol stack to enable short-range wireless data transmission between devices according to Bluetooth standards.

Working Principle

The IC converts digital data into radio signals for transmission and receives incoming signals, demodulating them back into digital data. It manages frequency hopping, packet assembly/disassembly, encryption, and connection establishment according to Bluetooth specifications.

Common Materials

Silicon semiconductor

Technical Parameters

Package dimensions including length, width, and height (mm) Per Request

Components / BOM

RF Transceiver
Transmits and receives radio frequency signals in the 2.4 GHz ISM band

Material: silicon
Baseband Processor
Processes digital signals, handles modulation/demodulation and error correction

Material: silicon
Protocol Stack Part
Implements Bluetooth communication protocols and profiles in firmware

Material: embedded software
Memory Part
Stores firmware, configuration data, and temporary buffers

Material: silicon

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Bluetooth IC/Chipset.

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Bluetooth Module

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Industrial Ecosystem & Supply Chain Structure

Complementary Systems

Downstream Applications

Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits

voltage:	1.7V to 3.6V typical operating range
rf power:	+0dBm to +20dBm output power range
temperature:	-40°C to +85°C (industrial grade), -40°C to +105°C (extended industrial)
frequency range:	2.402 GHz to 2.480 GHz ISM band

Media Compatibility

✓ Consumer electronics (smartphones, wearables) ✓ IoT devices (sensors, smart home) ✓ Industrial automation (wireless controls, monitoring)

Unsuitable: High-power RF interference environments (near radar systems, heavy industrial RF equipment)

Sizing Data Required

Required Bluetooth version/feature set (BLE 5.3, Mesh, etc.)
Target power consumption profile (battery life requirements)
Antenna design and RF path requirements

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause

Thermal degradation

Cause: Excessive heat from poor thermal management or high ambient temperatures leading to solder joint fatigue, material breakdown, and performance degradation.

Electrostatic discharge (ESD) damage

Cause: Improper handling during installation or maintenance without ESD protection, causing immediate or latent failure of sensitive semiconductor components.

Maintenance Indicators

Intermittent or complete loss of Bluetooth connectivity despite proper pairing and proximity
Unusual heat generation in the device housing or immediate area during normal operation

Engineering Tips

Implement proper thermal management with heat sinks or ventilation to maintain operating temperatures within manufacturer specifications.
Use ESD-safe practices during all handling, installation, and maintenance procedures, including grounded workstations and personnel protection.

Compliance & Manufacturing Standards

Reference Standards

ISO/IEC 17025:2017 - General requirements for the competence of testing and calibration laboratories ANSI C63.27 - American National Standard for Evaluation of Wireless Coexistence CE marking under Radio Equipment Directive (RED) 2014/53/EU

Manufacturing Precision

RF output power: +/- 2 dBm
Frequency tolerance: +/- 20 ppm

Quality Inspection

RF performance testing (conducted and radiated)
Protocol conformance testing (Bluetooth SIG qualification)

Factories Producing Bluetooth IC/Chipset

Manufacturer profiles with relevant production capability in China

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Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.

Procurement Evaluation Criteria

Not customer reviews or live demand data. These dimensions support RFQ preparation and supplier evaluation.

Technical documentation

4/5

Manufacturing capability

4/5

Inspection readiness

5/5

Supplier transparency

3/5

These scores are example evaluation dimensions, not real customer ratings, country-specific buyer feedback, or live inquiry activity.

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Frequently Asked Questions

What are the key applications for this Bluetooth IC in computer and optical product manufacturing?

This Bluetooth IC is ideal for wireless peripherals (keyboards, mice), IoT devices, smart sensors, optical communication equipment, and industrial automation systems requiring reliable short-range wireless connectivity.

How does the RF transceiver component affect Bluetooth performance?

The integrated RF transceiver enables stable 2.4GHz signal transmission with adaptive frequency hopping, providing reliable connections up to 100 meters (depending on environment) while minimizing interference in crowded wireless environments.

What protocol stacks are supported by this Bluetooth chipset?

The IC supports Bluetooth 5.2 protocol stack including Classic Bluetooth for audio/data transfer and Bluetooth Low Energy (BLE) for power-efficient applications, with backward compatibility to earlier Bluetooth versions.

Can I contact factories directly on CNFX?

CNFX is an open directory, not a transaction platform. Each factory profile provides direct contact information and production details to help you initiate direct inquiries with Chinese suppliers.

Data Basis

CNFX manufacturer profiles, technical classification, publicly available product information, and ongoing plausibility checks.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

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