Bluetooth IC/Chipset

Product Specifications

Technical details and manufacturing context for Bluetooth IC/Chipset

Definition

A Bluetooth IC (integrated circuit) is a specialized semiconductor component designed to implement the Bluetooth wireless communication standard. It integrates the radio frequency (RF) transceiver, baseband processor, and protocol stack onto a single chip, enabling short-range data exchange between devices. The IC operates in the 2.402–2.480 GHz ISM band, using frequency hopping across 79 channels with 1 MHz spacing. It supports Bluetooth versions 5.0–5.4, offering data rates of 1–3 Mbps for BR/EDR modes and 1–2 Mbps for BLE. The transmit power ranges from -20 to 10 dBm, with Class 1 up to 20 dBm and Class 2 typically 4 dBm. Receiver sensitivity is -90 to -95 dBm, indicating the minimum signal level for reliable reception. The IC operates on a supply voltage of 1.8–3.6 V (typical 3.3 V) and is rated for industrial temperature ranges: -40 to 85 °C operating and -40 to 125 °C storage. Humidity tolerance is 10–90% RH non-condensing. ESD rating is ±2 to ±8 kV (HBM). Common packages include QFN-32 to QFN-48, with footprints from 4×4 mm to 7×7 mm. The IC is fabricated on silicon semiconductor material. This component is typically mounted on a Bluetooth module, which includes additional circuitry such as antennas and power management. When selecting a Bluetooth IC, engineers must verify model-specific parameters, including exact Bluetooth version support, output power, sensitivity, and package dimensions, against the manufacturer's datasheet. Standards referenced include IEEE 802.15.1 for Bluetooth, ETSI EN 300 328 for RF performance, IEC 60068-2-1/2 for temperature testing, IEC 60068-2-78 for humidity, IEC 61000-4-2 for ESD, and JEDEC MS-026 for package outlines. These standards serve as procurement references and do not imply certification of a specific product. Always confirm compliance and performance with the legal manufacturer or supplier.

Working Principle

The Bluetooth IC converts digital data from a host device into radio frequency signals for transmission. It modulates the data using Gaussian frequency shift keying (GFSK) or other schemes, then transmits via the RF transceiver. On reception, it demodulates incoming signals back into digital data. The IC manages frequency hopping across 79 channels, packet assembly and disassembly, encryption, and connection establishment according to Bluetooth specifications. It handles error correction and retransmission to ensure reliable data transfer. The baseband processor executes the protocol stack, managing link control and higher-layer functions. The IC also interfaces with the host via standard buses like UART, SPI, or I2C, and may include integrated memory for firmware storage.

Common Materials

Silicon semiconductor

Technical Parameters

Parameter	Typical range	Notes & selection driver
Bluetooth Version	5.0–5.4	Higher versions offer better range and data rate.IEEE 802.15.1
Operating Frequency	2.402–2.480 GHz	ISM band, 79 channels with 1 MHz spacing.ETSI EN 300 328
Transmit Power	-20–10 dBm	Class 1: up to 20 dBm, Class 2: 4 dBm typical.ETSI EN 300 328
Receiver Sensitivity	-90–-95 dBm	Lower value indicates better performance.
Data Rate	1–3 Mbps	BR/EDR rates; BLE offers 1–2 Mbps.
Supply Voltage	1.8–3.6 V	Typical 3.3 V for most modules.
Operating Temperature	-40–85 °C	Industrial grade range.IEC 60068-2-1/2
Storage Temperature	-40–125 °C	Non-operating storage limit.IEC 60068-2-1/2
Humidity	10–90 % RH	Non-condensing.IEC 60068-2-78
ESD Rating	±2–±8 kV	HBM model; higher is better.IEC 61000-4-2
Package Type	QFN-32–QFN-48	Common packages for Bluetooth ICs.JEDEC MS-026
Footprint	4×4–7×7 mm	QFN package dimensions.JEDEC MS-026

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

RF Transceiver
Transmits and receives radio frequency signals in the 2.4 GHz ISM band

Material: silicon
Baseband Processor
Processes digital signals, handles modulation/demodulation and error correction

Material: silicon
Protocol Stack Part
Implements Bluetooth communication protocols and profiles in firmware

Material: embedded software
Memory Part
Stores firmware, configuration data, and temporary buffers

Material: silicon
Host Interface
The bus the host MCU uses to talk to the radio (UART/SPI/USB).

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Bluetooth IC/Chipset.

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Bluetooth Module

View system integration details

Manufacturers of Bluetooth IC/Chipset

Manufacturer profiles associated with Bluetooth IC/Chipset.

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Procurement Evaluation Criteria

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Frequently Asked Questions

What is the difference between a Bluetooth IC and a Bluetooth module?

A Bluetooth IC is the core semiconductor component that implements the Bluetooth protocol. A Bluetooth module typically includes the IC along with supporting components such as an antenna, crystal oscillator, and power management circuitry, packaged as a ready-to-use unit. The IC requires external components to function, while a module is often plug-and-play.

How do I choose the right Bluetooth IC for my application?

Consider the required Bluetooth version, data rate, transmit power, receiver sensitivity, supply voltage, operating temperature range, package type, and footprint. Verify these parameters against your system requirements and the manufacturer's datasheet. Also check compliance with relevant standards such as ETSI EN 300 328 for RF performance.

What does the receiver sensitivity value indicate?

Receiver sensitivity is the minimum input signal level (in dBm) that the IC can reliably detect and demodulate. A lower (more negative) value indicates better performance, as the IC can receive weaker signals. The range -90 to -95 dBm is typical for Bluetooth ICs, but actual performance varies by model.

Can a Bluetooth IC operate in extreme temperatures?

The specified operating temperature range is -40 to 85 °C, which is suitable for industrial applications. Storage temperature range is -40 to 125 °C. However, actual performance may degrade near the extremes, and you should verify the IC's behavior under your specific thermal conditions with the manufacturer.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification

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voltage:	1.7V to 3.6V typical operating range
rf power:	+0dBm to +20dBm output power range
temperature:	-40°C to +85°C (industrial grade), -40°C to +105°C (extended industrial)
frequency range:	2.402 GHz to 2.480 GHz ISM band

Product Specifications

Industry Taxonomies & Aliases

Applied To / Applications

Industrial Ecosystem & Supply Chain Structure

Application Fit & Sizing Matrix

Reliability & Engineering Risk Analysis

Compliance & Manufacturing Standards