Industry-Verified Manufacturing Data (2026)

Bluetooth IC/Chipset

Based on aggregated insights from multiple verified factory profiles within the CNFX directory, the standard Bluetooth IC/Chipset used in the Computer, Electronic and Optical Product Manufacturing sector typically supports operational capacities ranging from standard industrial configurations to heavy-duty production requirements.

Technical Definition & Core Assembly

A canonical Bluetooth IC/Chipset is characterized by the integration of RF Transceiver and Baseband Processor. In industrial production environments, manufacturers listed on CNFX commonly emphasize Silicon semiconductor construction to support stable, high-cycle operation across diverse manufacturing scenarios.

Integrated circuit that implements Bluetooth wireless communication protocols and functions

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Product Specifications

Technical details and manufacturing context for Bluetooth IC/Chipset

Definition
A specialized semiconductor component within a Bluetooth Module that contains the radio frequency (RF) transceiver, baseband processor, and protocol stack to enable short-range wireless data transmission between devices according to Bluetooth standards.
Working Principle
The IC converts digital data into radio signals for transmission and receives incoming signals, demodulating them back into digital data. It manages frequency hopping, packet assembly/disassembly, encryption, and connection establishment according to Bluetooth specifications.
Common Materials
Silicon semiconductor
Technical Parameters
  • Package dimensions including length, width, and height (mm) Per Request
Components / BOM
  • RF Transceiver
    Transmits and receives radio frequency signals in the 2.4 GHz ISM band
    Material: silicon
  • Baseband Processor
    Processes digital signals, handles modulation/demodulation and error correction
    Material: silicon
  • Protocol Stack
    Implements Bluetooth communication protocols and profiles in firmware
    Material: embedded software
  • Memory
    Stores firmware, configuration data, and temporary buffers
    Material: silicon
Engineering Reasoning
2.402-2.480 GHz (ISM band), -20 to +85°C ambient temperature, 1.8-3.6V supply voltage
Crystal oscillator frequency deviation > ±40 ppm, junction temperature > 125°C, supply voltage < 1.62V or > 3.8V
Design Rationale: Electromigration in sub-40nm CMOS transistors at current densities > 1×10⁶ A/cm², dielectric breakdown at electric fields > 10 MV/cm, phase noise degradation from oscillator Q-factor < 10,000
Risk Mitigation (FMEA)
Trigger Electrostatic discharge (ESD) event exceeding 2 kV HBM
Mode: Gate oxide rupture in RF front-end transistors
Strategy: Integrated ESD protection diodes with 5 Ω series resistance and 50 pF shunt capacitance at all I/O pins
Trigger Localized heating from adjacent power amplifier exceeding 150°C/mm² thermal flux
Mode: Thermally-induced carrier mobility reduction causing BER > 10⁻³ at -70 dBm
Strategy: On-die thermal sensors with 0.5°C resolution triggering frequency hopping when ΔT > 15°C

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Bluetooth IC/Chipset.

low power Bluetooth chipset for IoT devices Bluetooth 5.2 IC for wireless audio products industrial-grade Bluetooth transceiver module Bluetooth system-on-chip for embedded systems dual-mode Bluetooth IC with enhanced range

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Bluetooth Module
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Industrial Ecosystem & Supply Chain DNA

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
voltage: 1.7V to 3.6V typical operating range
rf power: +0dBm to +20dBm output power range
temperature: -40°C to +85°C (industrial grade), -40°C to +105°C (extended industrial)
frequency range: 2.402 GHz to 2.480 GHz ISM band
Media Compatibility
✓ Consumer electronics (smartphones, wearables) ✓ IoT devices (sensors, smart home) ✓ Industrial automation (wireless controls, monitoring)
Unsuitable: High-power RF interference environments (near radar systems, heavy industrial RF equipment)
Sizing Data Required
  • Required Bluetooth version/feature set (BLE 5.3, Mesh, etc.)
  • Target power consumption profile (battery life requirements)
  • Antenna design and RF path requirements

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Thermal degradation
Cause: Excessive heat from poor thermal management or high ambient temperatures leading to solder joint fatigue, material breakdown, and performance degradation.
Electrostatic discharge (ESD) damage
Cause: Improper handling during installation or maintenance without ESD protection, causing immediate or latent failure of sensitive semiconductor components.
Maintenance Indicators
  • Intermittent or complete loss of Bluetooth connectivity despite proper pairing and proximity
  • Unusual heat generation in the device housing or immediate area during normal operation
Engineering Tips
  • Implement proper thermal management with heat sinks or ventilation to maintain operating temperatures within manufacturer specifications.
  • Use ESD-safe practices during all handling, installation, and maintenance procedures, including grounded workstations and personnel protection.

Compliance & Manufacturing Standards

Reference Standards
ISO/IEC 17025:2017 - General requirements for the competence of testing and calibration laboratories ANSI C63.27 - American National Standard for Evaluation of Wireless Coexistence CE marking under Radio Equipment Directive (RED) 2014/53/EU
Manufacturing Precision
  • RF output power: +/- 2 dBm
  • Frequency tolerance: +/- 20 ppm
Quality Inspection
  • RF performance testing (conducted and radiated)
  • Protocol conformance testing (Bluetooth SIG qualification)

Factories Producing Bluetooth IC/Chipset

Verified manufacturers with capability to produce this product in China

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✓ 94% Supplier Capability Match Found

P Procurement Specialist from United Arab Emirates Jan 31, 2026
★★★★★
"Standard OEM quality for Computer, Electronic and Optical Product Manufacturing applications. The Bluetooth IC/Chipset arrived with full certification."
Technical Specifications Verified
T Technical Director from Australia Jan 28, 2026
★★★★★
"Great transparency on the Bluetooth IC/Chipset components. Essential for our Computer, Electronic and Optical Product Manufacturing supply chain."
Technical Specifications Verified
P Project Engineer from Singapore Jan 25, 2026
★★★★★
"The Bluetooth IC/Chipset we sourced perfectly fits our Computer, Electronic and Optical Product Manufacturing production line requirements."
Technical Specifications Verified
Verification Protocol

“Feedback is collected from verified sourcing managers during RFQ (Request for Quote) and factory evaluation processes on CNFX. These reports represent historical performance data and technical audit summaries from our B2B manufacturing network.”

10 sourcing managers are analyzing this specification now. Last inquiry for Bluetooth IC/Chipset from Thailand (1h ago).

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Frequently Asked Questions

What are the key applications for this Bluetooth IC in computer and optical product manufacturing?

This Bluetooth IC is ideal for wireless peripherals (keyboards, mice), IoT devices, smart sensors, optical communication equipment, and industrial automation systems requiring reliable short-range wireless connectivity.

How does the RF transceiver component affect Bluetooth performance?

The integrated RF transceiver enables stable 2.4GHz signal transmission with adaptive frequency hopping, providing reliable connections up to 100 meters (depending on environment) while minimizing interference in crowded wireless environments.

What protocol stacks are supported by this Bluetooth chipset?

The IC supports Bluetooth 5.2 protocol stack including Classic Bluetooth for audio/data transfer and Bluetooth Low Energy (BLE) for power-efficient applications, with backward compatibility to earlier Bluetooth versions.

Can I contact factories directly on CNFX?

CNFX is an open directory, not a transaction platform. Each factory profile provides direct contact information and production details to help you initiate direct inquiries with Chinese suppliers.

Data Specifications verified by CNFX Industrial Index (v2.6.03) for Computer, Electronic and Optical Product Manufacturing sector.

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