Database Server
View system integration details
This page explains how Memory Modules (RAM) is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
Electronic components that provide temporary data storage for database servers, enabling fast access to frequently used information.
Technical details and manufacturing context for Memory Modules (RAM)
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Memory Capacity | 8–64 GB | Per module; higher capacity for larger databases |
| Data Rate | 3200–6400 MT/s | Higher speed reduces latencyJEDEC DDR5 |
| CAS Latency | 16–40 clocks | Lower is faster; trade-off with speed |
| Operating Voltage | 1.1–1.35 V | DDR5: 1.1V; DDR4: 1.2V; overclocking up to 1.35VJEDEC |
| Operating Temperature | 0–85 °C | Above 85°C may cause errorsJEDEC |
| Storage Temperature | -40–100 °C | Non-operational |
| Relative Humidity | 10–90 % | Non-condensing |
| Module Height | 31.25–42 mm | Standard UDIMM height; low-profile availableJEDEC |
| Module Width | 133.35 mm | Standard DIMM widthJEDEC |
| Weight | 15–30 g | Depends on heatsink and PCB layers |
| Pin Count | 288 pins | DDR4 and DDR5 both 288-pin but not compatibleJEDEC DDR4/DDR5 |
| Error Correction Code (ECC) | 0–1 bit | 1 for ECC modules; 0 for non-ECC |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is essential for the following industrial systems and equipment:
| voltage: | 1.2V to 1.35V (typical), ±5% tolerance |
| humidity: | 5% to 95% non-condensing |
| frequency: | 1600MHz to 4800MHz (DDR4/DDR5 range) |
| temperature: | 0°C to 85°C (operating), -40°C to 95°C (storage) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with Memory Modules (RAM).
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
A practical evidence checklist for RFQ preparation and supplier evaluation.
CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.
DDR4 and DDR5 are different generations of memory technology. They have different electrical specifications and are not compatible with each other. DDR5 offers higher data rates and lower operating voltage compared to DDR4. Both use a 288-pin connector, but the pinout and keying are different, so they cannot be interchanged. Always check the server's motherboard specifications to determine which generation is supported.
ECC stands for Error Correction Code. It is a feature that detects and corrects common types of data corruption. In database servers, ECC memory is often used to improve reliability. The parameter 'Error Correction Code (ECC)' is indicated as 0 (non-ECC) or 1 (ECC). Verify with the server manufacturer whether ECC is required.
CAS latency (CL) is the delay in clock cycles between the moment a memory controller requests data and the moment it is available. Lower CAS latency means faster access, but it often comes with a trade-off in speed. For database workloads, both data rate and latency affect performance. The typical range is 16 to 40 clocks. Confirm the optimal value for your application with the system manufacturer.
Check the server's documentation for supported memory types, capacities, and speeds. Verify that the module meets JEDEC standards for the appropriate generation (e.g., DDR5). Confirm the operating voltage, temperature range, and physical dimensions. Always consult the legal manufacturer or supplier to ensure the module is compatible with your specific server model.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
Ask for use case, specification boundaries, supplier type, and RFQ preparation information for this product.
Compare manufacturer profiles with relevant product and process capability.