Wafer transfer robots for semiconductor equipment · atmospheric robots in the EFEM that reach the FOUPs, vacuum robots inside process tools, reach, vertical stroke, repeatability at wafer centre, axis count, SEMI S2 and F47 compliance, and controllers
A wafer transfer robot picks wafers from carriers (FOUPs) and places them at aligners, load ports and process modules inside semiconductor equipment. Atmospheric robots work in the equipment front-end module (EFEM); vacuum robots work under vacuum inside the process tool. Ask three things first: atmospheric or vacuum, how many stations and FOUPs it must reach and at what heights, and which repeatability, cleanliness and SEMI requirements apply.
Robots that move wafers in semiconductor manufacturing equipment, both atmospheric (EFEM) and vacuum, with their controllers and aligners. Press-line and general material transfer robots, wafer stockers and complete EFEMs sold alone are outside this page except where compared.
01
Kawasaki describes wafer transfer as an important front-end process of semiconductor manufacturing equipment that needs high precision and speed. Its NTS series robot can reach two or three FOUPs of an EFEM without a track, and the series is compliant with SEMI F47 and SEMI S2. The TTS series adds a rigid telescopic mechanism for high-speed handling at high and low positions. [4] [2] [3]
Kawasaki's D60 controller runs single-arm robots with up to 7 axes and the D61 runs two-arm robots with up to 12 axes. Both are stated to comply with SEMI standards and CE marking. An optional aligner is listed with alignment in 2.5 seconds. [1]
| Item | NTS10/NTS20 | TTS10/TTS20 |
|---|---|---|
| Type | Horizontal articulated [1] | Telescopic horizontal articulated [1] |
| Axes | 4/5 [1] | 4/5 [1] |
| Maximum reach | 1,066 mm [1] | 1,066 mm [1] |
| Vertical (Z) stroke | 470 mm [1] | 740 mm [1] |
| Repeatability | ±0.1 mm at wafer centre, per ISO 9283 [1] | ±0.1 mm at wafer centre, per ISO 9283 [1] |
| Rotation axes | 340° each [1] | 340° each [1] |
| Controller and power | D60, 1.0 kVA [1] | D60, 1.0 kVA [1] |
Give the supplier the wafer size and type, the number of FOUPs or load ports and other stations with their positions and heights, atmospheric or vacuum operation, single or dual arm, end-effector type, the throughput target, the repeatability, the cleanroom class, the SEMI standards required (for example S2, F47), the controller interface and the space available.
02
Brooks, a semiconductor automation maker, describes its MagnaTran vacuum robots as providing precise wafer handling and transfer within process tools with consistent positioning and repeatability, including configurations for high-temperature environments. Its Marathon vacuum systems coordinate wafer transfer between atmospheric and vacuum environments, integrating the EFEM, load ports and process modules. Brooks names particle generation, vibration, thermal instability and transfer timing as risks to yield and uptime in vacuum transfer. [5]
Brooks states that more than 70,000 of its robots handle wafers in production. This is the maker's own figure. [5]
03
Kawasaki's catalogue gives the D60 (single-arm) and D61 (two-arm) controllers a full digital servo system, joint and base-coordinate teach modes, joint, linear and offset-linear interpolation in repeat mode, manual, semi-automatic and fully automatic teaching, and external emergency-stop, safety-fence and external-stop signals. Communication is RS-232C (one port on the D60, two on the D61) and Ethernet using Kawasaki's K-Utility command set for clean robots, with customised commands available on request. [1]
The controllers run on single-phase 208 V AC ±10% at 50/60 Hz, meet SEMI F47 for voltage-sag immunity, operate from 5 to 40 °C, and weigh 14 kg (D60) and 20 kg (D61). For NTS-series robots the D60 measures 320 × 130 × 300 mm and the D61 445 × 130 × 429 mm; for TTS-series robots 395 × 130 × 300 mm and 565 × 130 × 429 mm. [1]
Editorial calculation: a 1.0 kVA D60 on 208 V draws about 1,000 ÷ 208 ≈ 4.8 A, so a tool feeding two single-arm robots needs roughly 10 A of 208 V single-phase supply for the robots alone; confirm the tool host speaks K-Utility or that Kawasaki will supply custom commands before integration. [1]
04
This is a functional reference built from the sources cited; it is not one maker's specification.
| Part | Role | Fix in the order |
|---|---|---|
| Arm (articulated or telescopic) | Reaches FOUPs and stations. [1] | Reach; Z stroke; axes. |
| Drive system | Smooth, precise motion. [2] | Repeatability. |
| Controller | D60 single arm up to 7 axes; D61 two arms up to 12 axes. [1] | Axes; interface. |
| Aligner (option) | Aligns the wafer; 2.5 s stated. [1] | Needed or not. |
| Vacuum robot and platform | Transfers wafers inside the vacuum tool. [5] | Temperature; integration. |
05
A wafer robot quotation needs values for your tool. The table explains each field, gives published values where a reviewed source states them, and says what to ask the supplier for.
| Field | What it means and published values | Ask the supplier for |
|---|---|---|
| Environment | Atmospheric EFEM or vacuum. [2] [5] | Which one. |
| Reach and stations | Example: 2 and 3 FOUPs without a track; 1,066 mm. [1] | Station map. |
| Vertical stroke | Examples: 470 mm; 740 mm. [1] | Stroke for your heights. |
| Repeatability | Example: ±0.1 mm at wafer centre (ISO 9283). [1] | Test method. |
| Standards | Examples: SEMI S2; SEMI F47; CE. [1] | Compliance documents. |
| Controller | Axes: 7 (single arm) or 12 (two arms). [1] | Interface; software. |
06
Paste it into your enquiry below or into an email to a maker, then replace every bracket.
Wafer: [size; type; thickness] Environment: [atmospheric EFEM; vacuum] Stations: [FOUPs; aligner; process modules; positions and heights] Robot: [single or dual arm; end-effector] Performance: [throughput; repeatability] Standards: [SEMI S2; SEMI F47; CE; cleanroom class] Controller: [interface; host protocol]
This company lists this product on its own website.
Its website lists atmospheric wafer transfer robots in the Blade D and Blade S series.
Product scope checked 2026-10-12
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Kawasaki says its NTS and TTS robots reach 2 and 3 FOUPs of an EFEM without a track. [1]
Kawasaki lists ±0.1 mm at wafer centre, measured per ISO 9283, for its NTS and TTS robots. [1]
Brooks describes its vacuum robots as handling and transferring wafers within process tools, including high-temperature configurations. [5]
Kawasaki's D60 runs on single-phase 208 V AC ±10%, meets SEMI F47, and communicates over RS-232C and Ethernet with its K-Utility command set. [1]
Sources checked 2026-10-12. Kawasaki and Brooks describe their own robots; their figures are examples, not limits. The Kawasaki pages and catalogue are archived copies.
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