A lead frame is a metal structure inside semiconductor packages that provides electrical connections between the chip and external circuitry.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| CTE | 5-18 ppm/°C | |
| Pitch | 1.27mm, 2.54mm | |
| Lead Count | 4-16 pins | |
| Package Type | DIP, SOP, SSOP | |
| Isolation Voltage | 2500V-5000V | |
| Thermal Conductivity | 200-400 W/m·K |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A complete assembly containing the core photocoupler device and its supporting electrical/mechanical elements, designed for integration into an isolation barrier system.
An electronic component that transfers electrical signals between two isolated circuits using light waves.
The core light-producing component within warning light systems that generates visible illumination for signaling purposes.
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The lead frame provides electrical connections to the LED and photodetector chips while maintaining complete electrical isolation between input and output circuits, which is essential for photocoupler safety and functionality.
Copper alloys offer excellent electrical conductivity, good thermal dissipation, mechanical strength, and cost-effectiveness, making them ideal for most lead frame applications.
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