This page explains how SMT Stencil is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
Laser-cut stainless steel foil that meters solder paste onto PCB pads through precisely sized apertures before component placement.
Technical details and manufacturing context for SMT Stencil
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Foil Thickness | 0.1–0.3 mm | Determines solder paste volume; typical for fine pitch is 0.1–0.15 mm |
| Aperture Tolerance | ±0.01 mm | Critical for consistent paste deposition |
| Position Accuracy | ±0.02 mm | Ensures alignment with PCB pads |
| Aspect Ratio | 1.5–2.5 | Ratio of aperture width to foil thickness; below 1.5 risks paste release issues |
| Foil Material | 304 | Stainless steel grade; 304 is standard, 301 for higher strengthASTM A240 |
| Foil Hardness | 350–450 HV | Vickers hardness; ensures durability and dimensional stabilityISO 6507 |
| Surface Roughness | 0.4–0.8 μm Ra | Smooth walls improve paste releaseISO 4287 |
| Maximum Stencil Size | 736×736 mm | Common maximum for standard frames; larger available on request |
| Frame Type | 0–40 mm | Framed or frameless; frame height typically 40 mm |
| Operating Temperature | -40–85 °C | Storage and handling temperature range |
| Humidity Resistance | 0–95 % RH | Non-condensing; no corrosion under normal storage |
| Weight | 1.5–3.5 kg | Depends on size and frame |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
| fit: | matched to printer platform frame size |
| formats: | framed, frameless quick-change systems |
| finishes: | laser-cut, electropolished, nano-coated |
| foil range: | 80-150 µm with step-up/step-down zones |
| aperture rules: | area ratio ≥0.66, aspect ratio ≥1.5 per IPC-7525 |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
A practical evidence checklist for RFQ preparation and supplier evaluation.
CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.
12 companies list this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
Ask for use case, specification boundaries, supplier type, and RFQ preparation information for this product.
The typical foil thickness is 80-150 µm, but the parameter range on file is 0.1–0.3 mm. For fine-pitch applications, 0.1–0.15 mm is common. Always confirm the required thickness for your specific application with the manufacturer.
The aspect ratio is the ratio of aperture width to foil thickness. The typical range is 1.5–2.5. Below 1.5, paste release issues may occur, to insufficient solder paste on pads. It is a key design parameter for stencil performance.
IPC-7525 provides stencil design guidelines. Foil material is often 304 stainless steel per ASTM A240, hardness per ISO 6507, and surface roughness per ISO 4287. Downstream acceptance may reference IPC-A-610. Verify compliance with the manufacturer.
Yes, frameless stencils are available for quick-change systems. The frame type parameter ranges from 0 to 40 mm, where 0 indicates frameless. Frameless stencils are often used in high-mix environments for faster changeovers.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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