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This page explains how Main Circuit Board is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
The primary printed circuit board (PCB) that integrates and interconnects all major electronic components within an Enterprise-Grade VoIP Desk Phone.
Technical details and manufacturing context for Main Circuit Board
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Board Dimensions | 150–200 x 100–150 mm | Typical for VoIP desk phones |
| Layer Count | 4–8 layers | Higher for complex routing |
| Board Thickness | 1.6 ±10% mm | Standard thicknessIPC-6012 |
| Copper Weight | 1–2 oz | 1 oz for signal, 2 oz for powerIPC-6012 |
| Minimum Trace Width/Space | 0.1–0.15 mm | Tighter for high-densityIPC-2221 |
| Operating Temperature | -40–85 °C | Industrial gradeIPC-7351 |
| Storage Humidity | 5–95 % RH | Non-condensingIEC 60068-2-78 |
| Input Voltage | 9–36 V DC | Wide range for PoE and adapters |
| Current Consumption | 0.5–1.5 A | Depends on peripherals |
| Impedance Control | 100 ±10% Ω | For Ethernet differential pairsIPC-2141 |
| Surface Finish | ENIG | Good solderability and shelf lifeIPC-4552 |
| Solder Mask Color | Green | Standard color |
| Weight | 100–200 g | Varies with layer count and size |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is essential for the following industrial systems and equipment:
| pressure: | N/A (atmospheric) |
| other spec: | Humidity: 10% to 90% non-condensing, Power: 48V DC PoE (802.3af/at) or 12V DC adapter |
| temperature: | 0°C to 40°C (operating), -20°C to 70°C (storage) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with Main Circuit Board.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
A practical evidence checklist for RFQ preparation and supplier evaluation.
CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.
The typical board thickness is 1.6 mm ±10%, as listed in the parameters, with reference to IPC-6012. However, actual thickness may vary by model, so verify with the manufacturer.
The listed surface finish is ENIG (Electroless Nickel Immersion Gold), per IPC-4552. This finish provides good solderability and shelf life, but confirm the specific finish for your model.
The operating temperature range is -40 to 85 °C, as specified in the parameters. This is an industrial-grade range, but always check the actual product datasheet.
The layer count is typically 4 to 8 layers, depending on routing complexity. Higher layer counts are used for more complex designs. Verify the exact layer count with the supplier.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
Ask for use case, specification boundaries, supplier type, and RFQ preparation information for this product.
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